FIELD: physics.
SUBSTANCE: invention relates to silicon semiconductor technology, in particular to silicon photovoltaic converters manufactured according to heterostructure technology. Structure of a heterojunction photoelectric converter (PEC) includes a substrate in the form of a silicon wafer, on both sides of which a layer of passivation is applied in the form of layers of amorphous hydrogenated silicon, n-type semiconductor layer is deposited on one side of the silicon substrate with deposited passivating layers, and a p-type semiconductor layer is deposited on the opposite side, anti-epitaxial layer in the form of amorphous hydrogenated germanium or amorphous hydrogenated silicon-germanium with a thickness of up to 10 nm is applied to the surface of the silicon wafer in front of the passivation layers.
EFFECT: invention makes it possible to reduce surface recombination and improve the quality of passivation of the surface of a silicon wafer, the result is increased efficiency of solar cells.
3 cl, 2 dwg, 4 ex
| Title | Year | Author | Number |
|---|---|---|---|
| SILICON-BASED DOUBLE-SIDED HETEROJUNCTION PHOTOVOLTAIC CONVERTER | 2021 |
|
RU2757544C1 |
| SOLAR CELL | 2015 |
|
RU2590284C1 |
| STRUCTURE OF PHOTOCONVERTER BASED ON CRYSTALLINE SILICON AND ITS PRODUCTION LINE | 2016 |
|
RU2632267C2 |
| SILICON WAFER SURFACE PASSIVATION BY MAGNETRON SPUTTERING | 2015 |
|
RU2614080C1 |
| HETEROSTRUCTURE PHOTOELECTRIC CONVERTER BASED ON CRYSTALLINE SILICON | 2016 |
|
RU2632266C2 |
| PHOTOELECTRIC TRANSDUCER WITH A SELF-HEALING CONTACT | 2017 |
|
RU2651642C1 |
| CONTACT GRID OF HETEROTRANSITIONAL PHOTOELECTRIC CONVERTER BASED ON SILICON AND METHOD OF ITS MANUFACTURE | 2016 |
|
RU2624990C1 |
| METHOD OF COMMUTATION OF HETEROSTRUCTURAL PHOTOELECTRIC CONVERTERS | 2016 |
|
RU2623820C1 |
| CONSTRUCTION OF THIN-FILM SOLAR MODULE AND METHOD OF ITS MANUFACTURE | 2016 |
|
RU2648341C2 |
| PHOTO ELECTRIC CONVERTER (VERSIONS) AND METHOD OF ITS FABRICATION (VERSIONS) | 2009 |
|
RU2417481C2 |
Authors
Dates
2018-12-14—Published
2017-11-07—Filed