METHOD OF PREPARING SUBSTRATE SURFACE FROM ALUMINUM NITRIDE CERAMIC WITH HOLES FORMED BY LASER CUTTING, FOR THIN-FILM METALLISATION Russian patent published in 2020 - IPC H01L21/46 

FIELD: electronic equipment.

SUBSTANCE: invention can be used in electronic engineering and radio industry, in particular, in production of high-power microwave devices and power electronics modules. Said technical result is ensured by the fact that in the method of preparing the substrate surface from an aluminum nitride ceramic with holes formed by laser cutting, for thin-film metallisation, involving a step for cleaning acidic etching agents, washing the acid with water and drying, cleaning step in acidic etching agents is carried out at temperature of melting ice until complete removal of aluminum from surface of holes. Etching agent used is preferably a solution of hydrochloric acid in water with ratio of 0.7–1.3 of volumetric parts of acid per 1 volume part of water.

EFFECT: high-quality cleaning of substrate surface from aluminum nitride ceramics, with holes formed by laser cutting.

1 cl, 1 dwg, 1 tbl