FIELD: electronic equipment.
SUBSTANCE: invention relates to sealing of frameless electronic elements. Said technical result is achieved by the fact that a group of electronic cards, on the surface of which the shell-less elements are installed, after the degreasing process and the surface treatment of the frameless elements and the electronic boards, the protective layers are applied, first on the unpacked elements, which total height does not exceed h=1 mm, leads and contact pads are applied with layer of elastic silicone compound of super-high purification, and after curing of said layer, a layer of mechanically strong organosilicon compound is applied on the entire surface of the board, wherein the total thickness of the protective layer ranges from H1=2h to H2=Θ, where h is the bonnet structure element height, Θ—rating of landing tolerance on the size of the target product, for which after application of first layer of elastic silicone compound of super-high purification each electronic board from the specified group is placed into individual cell in limiting device for pouring, depth of each cell of limiting device corresponds to sum of thickness of electronic board and layer of organosilicon compound, and number of individual cells is equal to number of electronic boards in specified group.
EFFECT: technical result is increased efficiency, increased number of non-defective products, protection against external effects.
1 cl, 1 tbl, 4 dwg
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Authors
Dates
2021-01-28—Published
2019-10-03—Filed