DEVICE FOR MANUAL ALIGNMENT OF SILICON WAFERS PRIOR TO TEMPORARY SPLICING Russian patent published in 2021 - IPC H01L21/67 

FIELD: microelectronic engineering.

SUBSTANCE: invention relates to the field of microelectronic engineering. The device for manual alignment of silicon wafers before their temporary splicing includes a base made with a platform in the form of a recessed flat support surface, which is bounded by an annular side wall in the wall to accommodate a silicon wafer. There is an annular recess in the plan between the side wall and the platform at the base. At least one cutout is made in the base and directed towards the geometrical center of the platform and made with a length greater than the sum of the thickness of the side wall and the width of the specified recess. In this case, on one side at the base, the side wall with the platform inside and the recess are displaced towards one edge of the base to form an opening in the side wall, closed by a support element with a flat wall facing the platform to form a linear contour in plan, corresponding to a straight line in plan base cut of the silicon wafer.

EFFECT: invention is aimed at increasing accuracy of manual positioning of aligned silicon wafers with a diameter of 100 mm when they are connected with an adhesive layer, due to the fact that the device allows positioning the aligned wafers relative to the base cut, and not according to the shape of the disk.

1 cl, 9 dwg