FIELD: MEMS devices sealing.
SUBSTANCE: invention relates to methods for sealing MEMS devices. The method consists in the formation of grooves in the base, the use of temporary bonding technology with the thinning process, the filling of the grooves by the method for atomic layer deposition of material, while the connection busbars are removed from the working area of sealing through the reverse side of the base, the formation of a recess in the base and a working The cavity is produced due to one photomask and one plasma-chemical etching, the formation of protrusions and the getter area on the cover, while the protrusions of the cover and the base recesses have a cylindrical shape, the same diameter and height.
EFFECT: improved sealing of the final MEMS device.
1 cl, 10 dwg
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