FIELD: physics.
SUBSTANCE: invention relates to the field of technology for the production of semiconductor devices, in particular to the technology of manufacturing a thin-film transistor with a reduced value of leakage currents. A method for manufacturing a thin-film transistor includes the processes of forming areas of drain, source, gate, gate oxide, amorphous silicon film on a glass substrate. According to the invention, a film of amorphous silicon a-Si:H is formed by deposition in an HF discharge with decomposition in a glow discharge of disilane dissolved in helium at a ratio He/Si2H6=9/1 on a glass substrate at a gas pressure of 130 Pa, HF power of 8 W, at frequency of 13.56 MHz and a substrate temperature of 280°C, with a gas flow rate of 200 cm3/min and a film deposition rate of 1.2 nm/s.
EFFECT: invention makes it possible to manufacture a thin-film transistor with a reduced value of leakage currents.
1 cl, 1 tbl
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Authors
Dates
2021-06-11—Published
2020-10-01—Filed