FIELD: technological processes.
SUBSTANCE: invention relates to technology of production of semiconductor devices, particularly to production of amorphous silicon α-Si with low density of defects. Method of making semiconductor device according to the invention includes processes of forming source regions, drain, gate, gate isolation layer and a layer of amorphous silicon, wherein the layer of amorphous silicon is made by photodegradation of disilane molecules with the rate of deposition 5.5 nm/s, at the temperature of 400 °C, pressure 1.33 PA at action of laser beam power 140 MJ/min and disilane flow rate – 20 cm3/min.
EFFECT: invention increases percentage yield of serviceable devices, improving their quality and reliability.
1 cl, 1 tbl
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Authors
Dates
2017-01-10—Published
2015-05-14—Filed