FIELD: semiconductor production.
SUBSTANCE: invention relates to the field of technology for the production of semiconductor devices, in particular to the technology for the manufacture of thin-film transistors with a reduced value of leakage currents. The method for manufacturing a thin-film transistor involves the formation of amorphous silicon a-Si by deposition at a rate of 0.5 nm/s in an induction-plasma reactor from a mixture of PH3-SiH4, at a frequency of 13.55 MHz, a voltage of 250 V, a substrate temperature of 300°C, a gas pressure of 6.6 Pa, a mixture flow rate of 5 cm3/min and a concentration ratio of PH3/SiH4=10-6-10-3.
EFFECT: invention makes it possible to increase the percentage of yield of suitable devices and improve their reliability.
1 cl
Title | Year | Author | Number |
---|---|---|---|
METHOD FOR MANUFACTURING A THIN-FILM TRANSISTOR | 2020 |
|
RU2749493C1 |
METHOD OF MAKING SEMICONDUCTOR DEVICE | 2011 |
|
RU2466476C1 |
METHOD FOR MAKING SEMICONDUCTOR DEVICE | 2017 |
|
RU2661546C1 |
METHOD OF MAKING A SEMICONDUCTOR DEVICE | 2015 |
|
RU2606248C2 |
METHOD OF MAKING THIN-FILM TRANSISTOR | 2012 |
|
RU2515334C1 |
METHOD OF THIN FILM TRANSISTOR MANUFACTURING | 2012 |
|
RU2522930C2 |
METHOD OF MAKING A SEMICONDUCTOR DEVICE | 2015 |
|
RU2606780C1 |
METHOD FOR MANUFACTURING OF SEMICONDUCTOR DEVICE | 2023 |
|
RU2813176C1 |
METHOD OF MAKING SEMICONDUCTOR DEVICE | 2015 |
|
RU2584273C1 |
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | 2014 |
|
RU2581418C1 |
Authors
Dates
2021-09-08—Published
2020-11-23—Filed