METHOD FOR MANUFACTURE OF MICROASSEMBLY OF FRAMELESS ELECTRONIC COMPONENTS ON FLEXIBLE ORGANIC SUBSTRATES Russian patent published in 2021 - IPC H05K3/46 H05K3/30 H05K3/40 

FIELD: electric elements.

SUBSTANCE: invention relates to microassembly, particularly, to a technology for installation of a frameless electronic component base on flexible substrates. The technical result is achieved by creating multilayer switching with formation of electrical contacts with the leads of frameless electronic components (FEC) the crystals whereof are pre-thinned to a thickness of less than 100 mcm and installed on the adhesive with leads facing upward on a flexible organic substrate. The height difference at the interface of the FEC and the substrate is leveled by local application of layers of dielectric material along the perimeter around the FEC by a method of ink jet printing, gradually increasing the perimeter of the printing area, wherein a the step at the interface of the component and the substrate is gradually smoothed with formation of a uniform smooth surface for formation of a multilayer commutation, whereon the lower switching layer providing electrical connection of the FEC leads with the multilayer switching is applied. Then dielectric and conductive layers are consequently applied by a method of inkjet printing to create multilayer switching. Windows are therein left in the dielectric layers during printing, by means whereof electrical contact between the levels of multilayer commutation is provided.

EFFECT: provided are flexibility of the resulting product and reduction of thickness thereof during manufacture of microassembly of frameless components on flexible substrates.

1 cl, 1 dwg