METHOD FOR SOLDERING SEMICONDUCTOR CRYSTALS Russian patent published in 2023 - IPC H01L21/58 

FIELD: microelectronics.

SUBSTANCE: invention relates to the technology of mounting semiconductor crystals by soldering and can be used in the production of discrete devices and integrated circuits. The technical objective of the invention is to reduce thermoelastic stresses in the crystal when it is fixed in the device body and when it operates in a wide temperature range and, therefore, increase the reliability of the device. A layer of aluminium oxide is applied to the brazed side of the plate and to the body, after which the plate is cut into crystals from the oxide side, the assemblies are assembled: crystal-solder-body, where low-temperature solder is used as a solder, the assemblies are placed in a vacuum chamber and crystal soldering is done. If titanium alloys are used as the material of instrument cases, then the bases of the cases can be used for soldering without first applying a layer of aluminium oxide on them.

EFFECT: method can be used for group fastening of semiconductor crystals to instrument cases.

2 cl, 3 dwg