METHOD FOR FORMING THROUGH HOLES IN GLASS PLATES Russian patent published in 2023 - IPC H01L21/48 H01L21/33 

FIELD: micromechanical devices.

SUBSTANCE: methods for forming through holes in glass plates used for the manufacture of micromechanical devices. The method for forming through holes in glass plates consists in applying a layer of the first polysilicon material on the front and back sides of the plate, applying a layer of photosensitive material on the front side of the plate and forming a topological pattern in it, etching by sandblasting to form non-through holes that do not completely pass through glass plate, performing liquid etching until a blind hole is formed, passing through the glass plate, but not passing through the layer of the first material on the back side of the plate, removing the layer of the first material from both sides of the plate, in which a layer of the second material is applied to the layer of the first material, which represents an electrically conductive sublayer, the formation of a topological pattern is carried out in a layer of a third material, photosensitive, and on the surface of the second material, not occupied by the topological pattern, a layer of the fourth material is applied, which is a metal formed by electrochemical deposition, at the last stage the layers of the fourth and second material are removed, while sandblasting consists of the first and second stages of etching.

EFFECT: development of a method for forming through holes in glass plates with a high density of through holes, which makes it possible to increase the reproducibility of the method and the quality of finished products.

8 cl, 7 dwg