FIELD: various technological processes.
SUBSTANCE: invention relates to a device for applying a metal coating on a metal substrate in a vacuum. Said device comprises a vacuum chamber, a substrate attachment assembly, two magnetrons or two thermal evaporators and movable screens configured to protect an unused magnetron or thermal evaporator from metal sprayed onto a metal substrate during successive sputtering of said metal. Said movable screens, two magnetrons or two thermal evaporators are equipped with linear magnetic drives to control their movement. Attachment assembly of the metal substrate, having a diameter of up to 50 mm, comprises a heater and a cooler.
EFFECT: enabling possibility of successive sputtering of two different metals without depressurization of the vacuum chamber housing, improved tightness of the vacuum chamber housing and broader functional capabilities of the proposed device.
1 cl, 3 dwg
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Authors
Dates
2024-04-19—Published
2023-06-29—Filed