DEVICE FOR HYDROMECHANICAL AND MEGASONIC PROCESSING OF SEMICONDUCTOR WAFERS Russian patent published in 2025 - IPC H01L21/306 B08B3/04 

FIELD: cleaning.

SUBSTANCE: invention relates to cleaning the surface of flat articles using a hydromechanical and mega-sonic method using a detergent solution and can be used in semiconductor production when making ICs, LSICs and VLSICs prior to photolithography. Substance of the invention consists in the fact that in the device for hydromechanical and mega-sound processing of semiconductor plates, comprising a base plate, in which there are built-in: a processing unit with a bath and a drive with a centrifuge, on the shaft of which there is a vacuum table for placing the processed plate; brush drive vertical movement mechanism with a brush rotation drive, on which a brush with a collector for supplying deionised water and solution to the brush is fixed; mechanism for vertical movement of a mega-sound nozzle based on a pneumatic drive, including a mega-sound nozzle with a channel for supplying water to the nozzle, a plate centring unit with centring brackets is additionally introduced, a mechanism for vertical movement of the centrifuge, a mechanism for turning the brush, a mechanism for turning a megasonic nozzle, wherein the mechanism for vertical movement of the brush is based on a step motor, and the nozzle has a channel for supplying a detergent solution.

EFFECT: improved quality of processing and shorter drying time for semiconductor wafers, which increases efficiency of equipment based on the disclosed device.

1 cl, 3 dwg