COMPOUND FOR SEALING RADIO ELECTRONIC DEVICES Russian patent published in 1995 - IPC

FIELD: preparation of compositions used for bonding together, sealing and compacting components made of glass and metals in electronic engineering, more particularly in the manufacture of microdevices and liquid phase indicators. SUBSTANCE: the epoxy resin is an epoxydane resin or an epoxyorganosilicon resin, the organosilicon modifier is a mixture of low molecular dimethylsiloxane rubber with an epoxyorganosilicon oligomer which is a product of reaction of epychlorohydrin and oligophenylsiloxanes containing 18.4 % hydroxyl groups, 3$ phenyltriethoxysilane, 11.7-16.9 a mixed hardener based on aminoalkylimidazoline; 3.1-4.3 a filler. EFFECT: improved moisture resistance, adhesion strength and heat shock resistance.