FIELD: manufacture of integral schemes. SUBSTANCE: plasma-forming mixture containing sulfur hexafluoride and nitrogen is distinguished with that, in order to increase output of valid schemes due to reducing probability of the pinout corrosion and pollution of interlayer dielectric, mixture is supplemented with oxygen, content of components being the following: 45-55 vol % oxygen, 15-25 vol % sulfur hexafluoride, and nitrogen, the balance. EFFECT: improved quality of produce.
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Authors
Dates
1996-07-27—Published
1991-04-05—Filed