FIELD: manufacture of integrated circuits. SUBSTANCE: substrate carrying photoresist layer is heated by contactless method. Substrate is mounted in chamber with resist down. Steam-gas cushion with temperature 7-13 C lower than heater temperature is created under resist-carrying substrate. EFFECT: improved uniformity of photoresist layer on entire surface area of substrate. 1 dwg, 6 tbl
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Authors
Dates
1995-05-20—Published
1991-04-29—Filed