FIELD: manufacture of semiconductor injection laser for optical data processing devices, measurement, medical, and computer engineering. SUBSTANCE: photoresist mask is formed on heteroepitaxial structure and mesastrip is etched in it by ion-chemical method; embossed surface is subjected to anode oxidation, then oxide is removed by selective etching, cutoff contact is deposited and then removed together with photoresist mask from top of mesastrip by photoresist explosion method, then resistive contact layer is deposited. EFFECT: improved optical characteristics of laser. 2 ex, 2 dwg
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Authors
Dates
1996-09-27—Published
1990-08-22—Filed