MULTICOMPONENT CONDUCTOR-INSULATOR INTERLAYER-INSULATOR STRUCTURE Russian patent published in 2006 - IPC H01L21/20 

Abstract SU 1840166 A1

FIELD: microelectronics.

SUBSTANCE: proposed structure that that may be found useful for designing and developing various semiconductor devices characterized in definite electrophysical parameters for semiconductor-insulator interphase boundaries has chemical combinations of one or more elements used as interlayer and included in semiconductor composition. Chemical combinations are chosen so as to ensure that sum of their normalized volumes were lower than that of semiconductor by 1-15A3.

EFFECT: improved electrophysical parameters of structure.

1 cl

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SU 1 840 166 A1

Authors

Emel'Janov Arkadij Vladimirovich

Alekhin Anatolij Pavlovich

Egorkin Vladimir Vasil'Evich

Dates

2006-06-27Published

1986-05-22Filed