FIELD: electrical engineering.
SUBSTANCE: invention relates to the manufacturing technology of semiconductor devices containing a dielectric – semiconductor passive structure, including diodes and transistors, as well as radiation receivers sensitive in the spectral range (1÷3.5) mcm, such as photodiodes and phototransistors on n-type conduction InAs crystals. In the method of forming a dielectric layer by the method of anodic oxidation in galvanostatic mode at a current density of 0.5 mA/cm2 in an electrolyte based on a mixture of ethylene glycol and concentrated ammonia in a ratio of 5:1 with the addition of fluorine-containing components – salts NH4F, providing the concentration of NH4F in the electrolyte 12 g/l, the thickness of the layer of 350÷500 Ǻ is provided.
EFFECT: invention provides for the elimination of surface leakage currents and tunnel-type explosive noise, as well as an increase in the breakdown voltage of planar p+-n transitions on InAs crystals.
1 cl, 1 dwg
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Authors
Dates
2019-02-04—Published
2018-04-05—Filed