FIELD: electronic engineering. SUBSTANCE: high-frequency Gunn-effect device has n-type semiconductor material with n-type semiconductor layers formed on it on anode contact side and n++-type layers on cathode contact side located opposite to anode contact that has regions injecting current and annular regions limiting current injection in device; injecting region is surrounded by annular regions limiting current injection in device; inner diameter of annular region functions as projection of cylindrical hole passed through high-frequency device perpendicular to its base. EFFECT: improved design. 9 cl, 4 dwg
Title | Year | Author | Number |
---|---|---|---|
GUN-EFFECT HIGH-FREQUENCY DEVICE | 1995 |
|
RU2086051C1 |
GUNN-EFFECT HIGH-FREQUENCY DEVICE | 1992 |
|
RU2062533C1 |
MANUFACTURING METHOD FOR HIGH-FREQUENCY LIMITED-CURRENT-INJECTION GUNN DEVICE | 1992 |
|
RU2061277C1 |
HIGH-FREQUENCY DEVICE ON GUNN EFFECT | 1992 |
|
RU2014673C1 |
HIGH-FREQUENCY GUNN-EFFECT DEVICE | 1995 |
|
RU2091911C1 |
SEMICONDUCTOR DEVICE WITH INTERVALLEY TRANSFER OF ELECTRONS | 2008 |
|
RU2361324C1 |
SEMICONDUCTOR RECTIFIER MODULE | 1996 |
|
RU2091907C1 |
THYRISTOR TRIODE-THYROID | 2005 |
|
RU2306632C1 |
THYRISTOR LASER | 2019 |
|
RU2726382C1 |
SEMICONDUCTOR DEVICE HAVING PERIODIC ELECTRON-HOLE STRUCTURE | 2002 |
|
RU2245590C2 |
Authors
Dates
1996-02-10—Published
1993-02-24—Filed