FIELD: manufacture of integrated circuits and optoelectronic devices. SUBSTANCE: method involves growing GaAs buffer layer on semiconductor substrate made of GaAs followed by epitaxy of InSb layer in stage 3-solid-phase epitaxy of amorphous layer deposited at room temperature, low-temperature, and high-temperature epitaxy. EFFECT: enlarged functional capabilities.
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Authors
Dates
1996-06-27—Published
1990-08-14—Filed