FIELD: semiconductor instruments. SUBSTANCE: device is designed as n-type monocrystal silicon with radiation flaws which concentration is in range from 3•1012 per cubic centimeter for silicon which specific resistance ρo= 700 to 3•1013 per cubic centimeter for silicon which specific resistance ρo= 150. Flaws in silicon are generated by means of electron beam which power is 2-5 MeV and density is in range from 2,5•1014 per square centimeter for silicon with ρo= 700 to 2,5•1015 per square centimeter for silicon with ρo= 150. After radiation temperature-stabilization firing is performed. EFFECT: increased functional capabilities. 2 cl, 4 tbl, 2 dwg
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Authors
Dates
1997-07-27—Published
1995-03-23—Filed