FIELD: computer engineering; manufacture of memory cells. SUBSTANCE: protective insulation is made by covering semiconductor substrate with multilayer silicon oxide-polycrystalline silicon-silicon oxide structure (sandwich). For doping source areas and source connecting tracks photoresist mask is applied so that areas between word buses of respective pair of word buses are left free. Photoresist mask should cover only part of word buses and therefore it does not need high-precision adjustment. Doping material is then implanted in self-alignment manner relative to word buses due to high-energy implantation. If multilayer insulating structure is found too thick, anisotropic etching of silicon oxide layer above polycrystalline silicon layer may be made also in self-alignment manner before implantation. EFFECT: reduced space requirement for cell while adequate read-out characteristic is ensured. 6 cl, 13 dwg
Title | Year | Author | Number |
---|---|---|---|
HIGH-INTEGRATION SEMICONDUCTOR STORAGE DEVICE AND ITS MANUFACTURING PROCESS | 1996 |
|
RU2153210C2 |
PROCESS OF MANUFACTURE OF ELEMENTS OF STRUCTURES OF VERY SMALL SIZE ON SEMICONDUCTOR SUBSTRATE | 1996 |
|
RU2168797C2 |
NONVOLATILE MEMORY LOCATION | 1997 |
|
RU2205471C2 |
SEMICONDUCTOR STORAGE | 1998 |
|
RU2216819C2 |
ELECTRICALLY ERASABLE AND PROGRAMMABLE NONVOLATILE STORAGE CELL | 1996 |
|
RU2168242C2 |
METHOD FOR PRODUCING SEMICONDUCTOR NONVOLATILE MEMORY LOCATION WITH SEPARATE TUNNEL WINDOW | 2000 |
|
RU2225055C2 |
MEMORY DEVICE AND ITS MANUFACTURING PROCESS | 2001 |
|
RU2247441C2 |
NON-VOLATILE MEMORY DEVICE MANUFACTURING METHOD | 2022 |
|
RU2790414C1 |
SEMICONDUCTOR MEMORY DEVICE | 1999 |
|
RU2249262C2 |
NON-VOLATILE MEMORY DEVICE | 2023 |
|
RU2807966C1 |
Authors
Dates
2001-05-27—Published
1996-09-10—Filed