METHOD FOR EROSIVE COPYING OF SILICON-CARBIDE STRUCTURES Russian patent published in 2002 - IPC

Abstract RU 2189664 C2

FIELD: electronic instrumentation engineering. SUBSTANCE: method designed for dimensional profiling of silicon- carbide crystals to obtain structures of various configurations includes production of electricity conducting layer of at least 7•10-7 Ohm-1•cm-1 conductivity on one of substrate sides followed by initiating electrical discharge in aqueous medium between semiconductor substrate and metal electrode. Several silicon-carbide substrates are used and conducting layer is formed on all their surfaces; prior to initiating electrical discharge substrates are stacked and secured in electrode holder. EFFECT: enhanced productivity, enlarged functional capabilities. 3 cl, 1 dwg

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RU 2 189 664 C2

Authors

Karachinov V.A.

Dates

2002-09-20Published

2000-07-24Filed