METHOD FOR PRODUCING SEMICONDUCTOR DEVICE FEATURING LOW DENSITY OF FLAWS Russian patent published in 2003 - IPC

Abstract RU 2210141 C1

FIELD: manufacture of semiconductor devices. SUBSTANCE: during manufacture of semiconductor devices they undergo treatment by exposure to high-energy magnetic fields at all stages of process for minimum three hours followed by annealing at temperature of 300-400 C for 5-15 s. EFFECT: reduced flaw density, improved parameters, enhanced reliability and yield, facilitated manufacture. 1 cl, 1 tbl

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RU 2 210 141 C1

Authors

Mustafaev A.G.

Teshev R.Sh.

Mustafaev A.G.

Dates

2003-08-10Published

2002-01-08Filed