FIELD: manufacture of semiconductor devices. SUBSTANCE: during manufacture of semiconductor devices they undergo treatment by exposure to high-energy magnetic fields at all stages of process for minimum three hours followed by annealing at temperature of 300-400 C for 5-15 s. EFFECT: reduced flaw density, improved parameters, enhanced reliability and yield, facilitated manufacture. 1 cl, 1 tbl
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Authors
Dates
2003-08-10—Published
2002-01-08—Filed