FIELD: semiconductor device manufacture.
SUBSTANCE: upon formation of epitaxial film and silicon dioxide insulating layer on semiconductor substrate surface semiconductor structures are subjected to γ-quanta treatment at dose rate ranging between 105 and 106 radians and temperature ranging between 350 and 450 °C. Such treatment provides for reducing leakage currents, enhancing mobility of carriers within semiconductor devices, facilitating their manufacture, and improving their parameters.
EFFECT: enhanced reliability and yield.
1 cl
Title | Year | Author | Number |
---|---|---|---|
METHOD FOR MANUFACTURING OF SEMICONDUCTOR DEVICE | 2009 |
|
RU2431904C2 |
METHOD OF MAKING SEMICONDUCTOR STRUCTURE | 2010 |
|
RU2461090C1 |
METHOD OF THIN FILM TRANSISTOR MANUFACTURING | 2012 |
|
RU2522930C2 |
METHOD OF MAKING SEMICONDUCTOR DEVICE | 2008 |
|
RU2388108C1 |
METHOD FOR MANUFACTURE OF SEMICONDUCTOR INSTRUMENT | 2007 |
|
RU2356125C2 |
METHOD FOR FORMATION OF SEMICONDUCTOR DEVICE ALLOYED AREAS | 2011 |
|
RU2476955C2 |
METHOD OF SEMICONDUCTOR INSTRUMENT MANUFACTURING WITH LOW FLAW DENSITY | 2006 |
|
RU2330349C1 |
METHOD FOR MANUFACTURING A RADIATION-RESISTANT SEMICONDUCTOR INSTRUMENT | 2021 |
|
RU2785122C1 |
METHOD OF SEMICONDUCTOR INSTRUMENT MANUFACTURE | 2006 |
|
RU2340038C2 |
METHOD OF PREPARING SEMICONDUCTOR STRUCTURE | 2008 |
|
RU2378740C1 |
Authors
Dates
2007-10-20—Published
2006-03-20—Filed