FIELD: semiconductor device manufacture.
SUBSTANCE: upon formation of epitaxial film and silicon dioxide insulating layer on semiconductor substrate surface semiconductor structures are subjected to γ-quanta treatment at dose rate ranging between 105 and 106 radians and temperature ranging between 350 and 450 °C. Such treatment provides for reducing leakage currents, enhancing mobility of carriers within semiconductor devices, facilitating their manufacture, and improving their parameters.
EFFECT: enhanced reliability and yield.
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Authors
Dates
2007-10-20—Published
2006-03-20—Filed