FIELD: electrical engineering.
SUBSTANCE: in the method for formation of a semiconductor device alloyed areas, for creation of the semiconductor device alloyed working areas, one applies onto a formed substrate film with an alloying mixture and proceeds with laser ray treatment with pulse duration equal to 35 ns, radiation wavelength - to 308 nm and pulse energy density - to 200-500 mJ/cm2.
EFFECT: reduced defect density in the semiconductor structures to provide manufacturability, to improve parameters, to increase reliability and serviceable devices percentage yield.
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Authors
Dates
2013-02-27—Published
2011-05-06—Filed