FIELD: metallurgy.
SUBSTANCE: invention refers to a SiC plate with an outer diameter of six inches and to a method of its fabrication. To achieve that a polycrystalline SiC is being grown from at least one side of a small diameter plate surface made out of a mono crystalline α-SiC up to a dimension when its outer diameter corresponds to a manipulation device of an existing line for semiconductors fabrication; and than the polycrystalline SiC received out of the mono crystalline SiC on the surface of the plate is ground to achieve the SiC of a bigger diameter with a double structure where the polycrystalline SiC has been grown around the outer periphery of the smaller diameter plate out of the mono crystalline α-SiC.
EFFECT: economise fabrication of a semiconducting device on the base of a SiC an existing line of devices fabrication on the base of SiC is used so as to achieve the possibility to manipulate the plate of a smaller diameter made out of SiC.
5 cl, 4 dwg
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Authors
Dates
2008-06-20—Published
2003-06-30—Filed