FIELD: physics, semiconductors.
SUBSTANCE: invention refers to electronic engineering, specifically to ceramic-metal packages for SHF semiconductor devices. Method of packaging for SHF semiconductor device involves frame making of strip metal or metal alloy of specified set thickness. It is used for frame segment blanks of length equal to half frame perimeter, of specified height and wall thickness equal to that of strip and notched, at least, once for pressure shaped metal-ceramic terminals. Frame segments are grinded on magnetic plate thus ensuring group method of mechanical height dimension finish. It is following with cleaning of frame segment surface thereafter copper plated of thickness 10-100 mcm solution jumped. Frame is assembled by axial-symmetric attachment of its two parts then soldered with specified copper plating. Frame with metal-ceramic terminals and the bottom with hard solder at melting temperature 700-1000°C.
EFFECT: higher reliability, product yield, manufacturability, lower work content, saving of consumed material.
2 cl, 1 dwg, 1 tbl
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