FIELD: physics, semiconductors.
SUBSTANCE: invention is related to microelectronics and may be used in production of semiconductor instruments and integrated circuits. Substance of invention: in method for setting of silicon crystal three metals: chrome-nickel-silver (Cr-Ni-Ag) are serially sprayed on body base in single technological cycle onto setting surface of silicon crystal, and soldering of crystals to body base is carried out at the temperature of 300-320°C for 3-5 seconds.
EFFECT: increased reliability of crystal contact with body base and stability of connection process.
Title | Year | Author | Number |
---|---|---|---|
METHOD FOR INSTALLING SILICON TRANSISTOR CRYSTAL | 2023 |
|
RU2815323C1 |
METHOD FOR CONNECTING SILICON CHIP TO CHIP CARRIER OF SEMICONDUCTOR DEVICE | 1999 |
|
RU2173913C2 |
METHOD OF FORMING CONTACT TO DRAIN REGION OF SEMICONDUCTOR DEVICE | 2013 |
|
RU2534439C2 |
METHOD OF SEATING SILICON CHIP ONTO HOUSING BASE | 2005 |
|
RU2375787C2 |
METHOD FOR FORMATION OF CONTACT TO SILICONE TRANSISTOR COLLECTOR AREA | 2013 |
|
RU2534449C2 |
METHOD FOR CRYSTAL PLANTING ON CASE BASEMENT | 2021 |
|
RU2792837C2 |
METHOD FOR SETTING OF TITANIUM-GERMANIUM (Ti-Ge) CRYSTAL | 2020 |
|
RU2786366C2 |
METHOD OF MOUNTING SEMICONDUCTOR CHIPS ON A GOLD-COATED SURFACE | 2019 |
|
RU2714538C1 |
METHOD FOR TITAN-GERMANIUM CONTACT LAYER CREATION | 2007 |
|
RU2343586C1 |
METHOD FOR MAKING DIODES FOR MIDDLE-WAVE IR RANGE OF SPECTRUM | 2015 |
|
RU2647978C2 |
Authors
Dates
2009-06-20—Published
2008-01-22—Filed