FIELD: physics; semiconductors.
SUBSTANCE: invention relates to power semiconductor devices, specifically to high-voltage semiconductor devices. The semiconductor device periphery has a peripheral annular P-N junction, coated with a dielectric film and surrounded under the dielectric film by a spiral electroconductive film with Zener diodes, with the ends of the spiral connected to P- and N- regions of the junction on the surface of the semiconductor device. The spiral of the electroconductive film with Zener diodes has distance between turns selected based on a given condition.
EFFECT: neutralisation of effect of charge on stability of return leakage and breakdown voltage.
6 cl, 1 dwg
Title | Year | Author | Number |
---|---|---|---|
SEMICONDUCTOR INSTRUMENT | 2010 |
|
RU2437183C1 |
METHOD FOR MANUFACTURING OF SEMICONDUCTOR DEVICE | 2010 |
|
RU2431905C1 |
TRANSISTOR WITH CURRENT LIMITATION AND METHOD OF ITS MANUFACTURING | 2008 |
|
RU2370855C1 |
PERIPHERY OF SEMICONDUCTOR DEVICES WITH ENHANCED RESISTANCE TO IONIZING RADIATION | 2015 |
|
RU2638584C2 |
SEMICONDUCTOR DEVICE | 1992 |
|
RU2065229C1 |
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | 2013 |
|
RU2531122C1 |
BIPOLAR TRANSISTOR WITH DIELECTRIC-INSULATED GATE | 1992 |
|
RU2065642C1 |
HIGH-VOLTAGE PLANAR P-N JUNCTION | 1991 |
|
RU2019894C1 |
PROCESS OF MANUFACTURE OF PLANAR P - N JUNCTIONS ON INAS CRYSTALS OF N-TYPE CONDUCTIVITY | 1993 |
|
RU2045107C1 |
SEMICONDUCTOR DEVICE | 1996 |
|
RU2163045C2 |
Authors
Dates
2010-01-20—Published
2008-09-02—Filed