FIELD: electricity.
SUBSTANCE: device for deposition of particularly crystalline layers onto at least one particularly crystalline substrate with technological chamber 5 arranged by several wall parts 1, 2, 3, 4, wall parts 1, 2, 3, 4 of which are electroconductive and join with each other to make contacts 2', 2", 3', 3", with reactor body 6 made of non-electroconductive material and including wall parts 1, 2, 3, 4 of technological chamber, and with heating coil 7 of high frequency that surrounds wall parts 1, 2, 3, 4 of technological chamber, comprises massive screening heating tube 8 arranged between reactor 6 body and walls 1, 2, 3, 4 of technological chamber as a whole part, material of which is electroconductive to such an extent that it heats from vortex currents induced by high-frequency field generated by means of high-frequency coil 7, significantly suppresses high-frequency field and surrounds technological chamber 5 so that wall parts 1, 2, 3, 4 of technological chamber are heated with the help of heat radiation.
EFFECT: invention makes it possible to prevent local heating in the area of contact zones of separate wall parts of technological chamber, which provides for an even temperature profile inside of it.
14 cl, 5 dwg
Title | Year | Author | Number |
---|---|---|---|
ELECTROSTATIC HOLDER FOR USE IN HIGH-TEMPERATURE-TREATMENT VACUUM CHAMBER, METHOD FOR SUBSTRATE TREATMENT, AND EXPANSION UNIT OF ELECTROSTATIC HOLDER | 2002 |
|
RU2295799C2 |
REACTOR FOR PLASMA PRECIPITATION | 1992 |
|
RU2008741C1 |
DEPOSITION REACTOR WITH PLASMA SOURCE | 2011 |
|
RU2571547C2 |
ATOMIC LAYER DEPOSITION REACTOR FOR PROCESSING BATCH OF SUBSTRATES AND METHOD OF PROCESSING BATCH OF SUBSTRATES | 2011 |
|
RU2586956C2 |
REACTOR FOR PLASMA PROCESSING OF SEMICONDUCTOR STRUCTURES | 2017 |
|
RU2670249C1 |
INSTALLATION OF PLASMA-ENHANCED DEPOSITION AND METHOD FOR PRODUCTION OF POLYCRYSTALLINE SILICON | 2007 |
|
RU2404287C2 |
GASES TO THE REACTOR SUPPLYING METHOD FOR THE GROUP III METALS NITRIDES BASED EPITAXIAL STRUCTURES GROWING AND DEVICE FOR ITS IMPLEMENTATION | 2017 |
|
RU2673515C2 |
METHOD OF MANUFACTURING PRODUCTS, CONTAINING SILICON SUBSTRATE WITH SILICON CARBIDE FILM ON ITS SURFACE AND REACTOR OF REALISING THEREOF | 2013 |
|
RU2522812C1 |
METHOD OF LOADING THE SUBSTRATE INTO ASO REACTOR | 2012 |
|
RU2620230C2 |
DEVICE AND METHODS FOR ATOMIC LAYER DEPOSITION | 2016 |
|
RU2728189C1 |
Authors
Dates
2010-05-20—Published
2005-12-12—Filed