FIELD: process engineering.
SUBSTANCE: invention relates to production of location-free semiconductor silicon plates cut from monocrystals grown by the Czochralski method and used for making ICs and discrete electronic components. Proposed method comprises three-step heat treatment in inert atmosphere of argon at 1200±25°C for 30±10 s, at 800±10°C for 4.0±0.25 h (second step) and 1000±25°C for 16±0.25 h (third step).
EFFECT: efficient inner getter in large-diameter location-free silicon plates (150-300 mm).
3 dwg
Title | Year | Author | Number |
---|---|---|---|
METHOD OF HARDENING DISLOCATION-FREE SILICON PLATES | 2007 |
|
RU2344210C1 |
PROCESS OF GETTERING WORKING OF SILICON SUBSTRATES | 1997 |
|
RU2134467C1 |
PROCESS OF PREPARATION OF SILICON SUBSTRATES | 1996 |
|
RU2110115C1 |
METHOD FOR PRODUCING SILICON-ON-INSULATOR STRUCTURES | 1998 |
|
RU2139595C1 |
PROCESS OF MANUFACTURE OF SILICON EPITAXIAL STRUCTURES WITH INTERNAL GETTER | 1990 |
|
SU1797403A1 |
METHOD FOR PROCESSING OF SILICON PLATES | 1996 |
|
RU2105381C1 |
METHOD FOR PROCESSING OF SILICON SUBSTRATES | 1996 |
|
RU2098887C1 |
METHOD FOR TREATMENT OF SINGLE-CRYSTALLINE SILICON PLATES | 1996 |
|
RU2119693C1 |
METHOD FOR CARRYING OUT GETTERING TREATMENT OF EPITAXIAL LAYERS OF SEMICONDUCTOR STRUCTURES | 1999 |
|
RU2176422C2 |
PROCESS OF GETTERING TREATMENT OF SEMICONDUCTOR PLATES | 2001 |
|
RU2224330C2 |
Authors
Dates
2014-04-10—Published
2012-10-17—Filed