FIELD: physics.
SUBSTANCE: method for hybridisation of reading LSI chips and a photosensitive element array of photodetector devices includes pressing in indium microcontacts located on chips to be interfaced. The microcontacts are in the form of stretched rectangles with side dimensions smaller than the gaps between the microcontacts, both on the vertical and the horizontal. The microcontacts on the LSI chips and the photosensitive element array are located at an angle to each other.
EFFECT: high reliability of interfacing reading LSI chips and a photosensitive element array while preventing shorting of adjacent microcontacts.
5 dwg
Title | Year | Author | Number |
---|---|---|---|
METHOD FOR INCREASING DOCKING STRENGTH OF CRYSTALS | 2015 |
|
RU2613617C2 |
METHOD FOR FORMATION OF MATRIX MICROCONTACT ELEMENTS | 2017 |
|
RU2654944C1 |
METHOD FOR MANUFACTURING MICROCONTACTS | 2017 |
|
RU2655953C1 |
METHOD OF ON-LINE INSPECTION OF THE DOCKING QUALITY | 2017 |
|
RU2660020C1 |
METHOD OF ASSEMBLING INFRARED PHOTODETECTOR | 2013 |
|
RU2526489C1 |
METHOD TO INCREASE ACCURACY OF DOCKING QUALITY CONTROL | 2018 |
|
RU2686882C1 |
METHOD FOR QUALITY CONTROL OF GROUP DOCKING OF CRYSTALS | 2023 |
|
RU2819153C1 |
MULTICHIP POLYCHROMATIC PHOTO RECEIVER (PR) WITH EXPANDED SPECTRAL RESPONSE OF QUANTUM EFFICIENCY | 2014 |
|
RU2564813C1 |
METHOD OF MANUFACTURING THINNED TWO-SPECTRAL PHOTOSENSITIVE ASSEMBLY | 2017 |
|
RU2676052C1 |
METHOD OF MAKING PHOTODETECTOR MODULE BASED ON PbSe | 2012 |
|
RU2515190C1 |
Authors
Dates
2014-12-27—Published
2013-08-01—Filed