FIELD: electricity.
SUBSTANCE: in a semiconductor device a diode area and IGBT area are formed at the same semiconductor substrate. The diode area includes a multitude of anode layers with the first type of conductivity open at the surface of the semiconductor substrate and separated from each other. The IGBT area includes a multitude of contact layers of the body with the first type of conductivity open at the surface of the semiconductor substrate and separated from each other. An anode layer includes at least one or more first anode layers. The first anode layer is formed close to the IGBT area at least, and the square area in each of the first anode layers in the direction of the semiconductor substrate plane is more than the square area in each contact layer of the body in direct vicinity from the diode area in the direction of the semiconductor substrate plane.
EFFECT: invention prevents direct voltage growth in the diode area and increased heat losses.
2 cl, 5 dwg
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Authors
Dates
2015-09-10—Published
2011-08-30—Filed