FIELD: process engineering.
SUBSTANCE: invention relates to laser processing of non-metallic materials and can be used for scribing of semiconductor, ceramic and glass-like materials. Material surface is irradiated with pulse laser radiation. Groove required depth is ensured by dimensionless parameter equal to the product of material index of absorption in laser radiation wavelength by groove depth. Besides, it is defined by the effects of one or two laser pulses with power density of each being determined subject to material sublimation specific power, index of absorption in laser radiation wavelength and reflection index.
EFFECT: lower power input.
2 cl, 1 dwg
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