METHOD FOR LASER PUNCHING OF THROUGH HOLE IN NON-METAL PLATE Russian patent published in 2021 - IPC B23K26/382 H01L21/42 

FIELD: technological processes.

SUBSTANCE: invention relates to the field of technological processes; it can be used for laser punching of through holes in plates made of semiconductor, ceramic and glass-like materials. In a method for laser punching of a through hole in a non-metal plate, including the separation of a laser beam to two beams, impact on both sides of the plate with beams with equal energy density that is calculated by a ratio linking the specific sublimation energy of material Q, the reflection coefficient of plate material R and the absorption index of material χ at a wavelength of the impacting laser radiation, firstly, one side of the plate is impacted with three laser pulses with energy density in each pulse determined by the ratio

and then, both sides of the plate are impacted with energy density determined by the ratio

where e is the base of the natural logarithm; h is the plate thickness; and χh > 6.

EFFECT: reduction in energy consumption during laser punching of through holes in plates made of non-metal materials.

1 cl, 1 dwg