FIELD: manufacturing technology.
SUBSTANCE: invention relates to laser punching of through holes in plates of semiconductor, ceramic and vitreous materials. Laser beam is divided into two. Plates are exposed on both sides of the plate with equal density of energy, which is calculated from ratio connecting specific energy of sublimation of material Q, reflection coefficient of material of plate R and the material X absorption coefficient at the wavelength of the acting laser radiation, first act on both sides of the plate with a beam with one energy density, and then on the other.
EFFECT: reduced power consumption during laser piercing of through holes in plates out of nonmetallic materials.
1 cl, 2 dwg
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