FIELD: metal processing.
SUBSTANCE: invention relates to a method for laser processing of non-metallic plates and can be used for scribing semiconductor, ceramic and glassy materials. The required groove depth is achieved due to the sequential action of two laser pulses. The energy density in each pulse is determined depending on the specific sublimation energy of the plate material, the absorption index of the material at the wavelength of laser radiation, the reflection coefficient and the required groove depth. At the same time, the dimensionless parameter equal to the product of the groove depth by the absorption index of the material at the wavelength of laser radiation is greater than 2.
EFFECT: reducing energy costs when scribing non-metallic plates.
1 cl, 1 tbl
| Title | Year | Author | Number |
|---|---|---|---|
| NON-METAL PLATE LASER SCRIBING METHOD | 2022 |
|
RU2784517C1 |
| LASER PROCESSING OF NON-METALLIC MATERIALS | 2014 |
|
RU2566138C2 |
| LASER TREATMENT METHOD FOR NON-METAL PLATES | 2014 |
|
RU2574222C1 |
| METHOD FOR LASER PUNCHING THROUGH-HOLE IN NON-METAL PLATE | 2014 |
|
RU2582849C1 |
| METHOD FOR LASER PUNCHING OF THROUGH HOLE IN NON-METAL PLATE | 2020 |
|
RU2763276C1 |
| METHOD OF LASER PROCESSING NON-METALLIC PLATES | 2016 |
|
RU2624998C1 |
| METHOD OF LASER DRILLING OF THROUGH HOLES IN NON-METALLIC PLATE | 2016 |
|
RU2647387C2 |
| METHOD OF LASER PIERCING THROUGH HOLE IN NON-METAL PLATE | 2018 |
|
RU2688036C1 |
| METHOD OF LASER PROCESSING OF NON-METALLIC PLATES | 2016 |
|
RU2624989C1 |
| METHOD FOR LASER ANNEALING OF NON-METALLIC PLATES | 2021 |
|
RU2757537C1 |
