FIELD: optics; physics.
SUBSTANCE: invention relates to laser punching of through hole in non-metal plate and can be used in producing plates from semiconductor, ceramic and glass-like materials with holes. Plate surface is exposed to pulsed laser radiation. Pulsed radiation wavelength is selected from condition: 1.2<Xh<3.1, where X is plate material absorption at wavelength of laser radiation; h is thickness of plate. Initial laser beam is divided into two beams and coaxially to act on both surfaces of plate with energy density defined by relationship: 
where e is base of natural logarithm; Q is specific energy of sublimation material; R is coefficient of reflection of material. Surface of plate pre-polished.
EFFECT: reduced power consumption in laser punching of through holes in plates of non-metallic materials having volumetric absorption of laser radiation.
2 cl, 2 dwg
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