FIELD: laser processing.
SUBSTANCE: invention relates to a method for laser processing of non-metal plates and can be used for scribing semiconductor, ceramic and glassy materials. The surface of the plate is exposed to successive three laser pulses. The energy density in each of the pulses is determined as a function of the specific sublimation energy of the plate material, the absorption index of the material at the laser wavelength, the reflection coefficient, and the desired groove depth. In this case, the dimensionless parameter equal to the product of the groove depth and the material absorption index at the laser radiation wavelength is greater than 2.433.
EFFECT: reducing energy costs when scribing non-metallic plates.
1 cl, 1 tbl
| Title | Year | Author | Number |
|---|---|---|---|
| METHOD FOR LASER SCRIBING OF A NON-METALLIC PLATE | 2021 |
|
RU2761834C1 |
| LASER PROCESSING OF NON-METALLIC MATERIALS | 2014 |
|
RU2566138C2 |
| LASER TREATMENT METHOD FOR NON-METAL PLATES | 2014 |
|
RU2574222C1 |
| METHOD FOR LASER PUNCHING THROUGH-HOLE IN NON-METAL PLATE | 2014 |
|
RU2582849C1 |
| METHOD FOR LASER PUNCHING OF THROUGH HOLE IN NON-METAL PLATE | 2020 |
|
RU2763276C1 |
| METHOD OF LASER PROCESSING NON-METALLIC PLATES | 2016 |
|
RU2624998C1 |
| METHOD OF LASER DRILLING OF THROUGH HOLES IN NON-METALLIC PLATE | 2016 |
|
RU2647387C2 |
| METHOD OF LASER PIERCING THROUGH HOLE IN NON-METAL PLATE | 2018 |
|
RU2688036C1 |
| METHOD OF LASER PROCESSING OF NON-METALLIC PLATES | 2016 |
|
RU2624989C1 |
| METHOD FOR LASER ANNEALING OF NON-METALLIC PLATES | 2021 |
|
RU2757537C1 |
