FIELD: electricity.
SUBSTANCE: method of thin-film transistor manufacturing is suggested that includes processes for forming active areas of the device and layer of amorphous silicon, at that upon formation of the layer of amorphous silicon boron implantation is performed with energy of 30 keV, dose of 51 mcC/cm2 with further annealing at temperature of 1373-1423 K during 10 s.
EFFECT: reduced loss current, improved fabricability, instrument parameters and quality, increased percentage yield of serviceable devices.
1 tbl
Title | Year | Author | Number |
---|---|---|---|
METHOD OF THIN FILM TRANSISTOR MANUFACTURING | 2012 |
|
RU2522930C2 |
METHOD FOR MANUFACTURING OF SEMICONDUCTOR DEVICE | 2009 |
|
RU2431904C2 |
METHOD FOR PRODUCTION OF SEMICONDUCTOR DEVICE | 2020 |
|
RU2751982C1 |
METHOD OF MAKING SEMICONDUCTOR DEVICE | 2015 |
|
RU2596861C1 |
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | 2011 |
|
RU2497229C2 |
METHOD FOR MANUFACTURING OF THIN-FILM TRANSISTOR | 2018 |
|
RU2696356C1 |
SEMICONDUCTOR DEVICE MANUFACTURING METHOD | 2019 |
|
RU2723981C1 |
METHOD FOR SEMICONDUCTOR DEVICE FABRICATION | 2008 |
|
RU2433501C2 |
SEMICONDUCTOR DEVICE MANUFACTURING METHOD | 2020 |
|
RU2734094C1 |
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | 2014 |
|
RU2581418C1 |
Authors
Dates
2015-12-20—Published
2014-07-15—Filed