FIELD: chemistry.
SUBSTANCE: composition of polishing etching agent includes the following components: 7 volume parts of sulphuric acid (98%), 1 volume part of hydrogen peroxide (30%), 1 volume part of water, 3.5 volume parts of ethyleneglycol.
EFFECT: increase of polishing speed at specified speed of disk revolution.
2 dwg, 1 tbl
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