FIELD: chemistry.
SUBSTANCE: invention relates to methods of producing thin-film materials, particularly europium (III) oxide based thin films, and can be used to protect a EuO functional layer. The method of producing a protective dielectric layer of Eu2O3 for a semiconductor film obtained on a substrate includes the full oxidation of the surface layer of a EuO semiconductor film grown in an ultrahigh-vacuum chamber in the same chamber in oxygen. The pressure of the oxygen current ranges from 1·10-9 to 1·10-6 torr with the temperature of the substrate in the range of 0 to 19°C.
EFFECT: forming an effective protective dielectric layer of Eu2O3 on the surface of the functional layer of semiconductor europium oxide EuO, which is capable of preventing the degradation of the functional layer as a result of chemical reaction with the environment.
2 dwg, 1 ex
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Authors
Dates
2016-02-10—Published
2014-09-12—Filed