METHOD OF PRODUCING INTEGRATED CIRCUITS, OPTICAL DEVICES, MICROMACHINES AND MECHANICAL HIGH-PRECISION DEVICES WITH LAYERS OF STRUCTURED MATERIAL WITH LINE SPACING OF 50 NM OR LESS Russian patent published in 2016 - IPC G03F7/20 

FIELD: instrument making.

SUBSTANCE: invention can be applied for production of integrated circuits, optical devices, micromachines, and mechanical high-precision devices. This invention consists in that method for producing integrated circuits, optical devices, micromachines, and mechanical high-precision devices involves steps as follows: producing substrate with layers of structured material, having row interval of 50 nm and less, and characteristic ratio > 2; production of surface layers of structured material with positive or negative electric charge by means of contact of semiconductor substrate at least once with aqueous fluorine-free solution S, containing at least one fluorine-free cationic surfactant A having at least one cationic or potentially cationic group, at least one fluorine-free anionic surfactant A having at least one anionic or potentially anionic group, or at least one fluorine-free amphoteric surfactant A; removal of water fluorine-free solution S of contact with substrate.

EFFECT: technical result si providing integrated circuits for optical devices, with layers of structured material with characteristic ratio > 2.

11 cl, 3 dwg