FIELD: physics.
SUBSTANCE: method of forming a thin-film pattern on a substrate using local laser irradiation of the previously deposited film according to the invention, the irradiation is conducted in the mode of the pulsed two-phase film destruction, then the substrate is subjected to uniform surface etching to the thickness not less than the film thickness on the unexposed areas of the substrate. A version of the method is also proposed, in which the irradiation is conducted with simultaneous exposure of two coherent laser beams, which form a periodic interference pattern on the surface, wherein the irradiation intensity provides a mode of the pulsed two-phase local film destruction.
EFFECT: method of forming addressable one-dimensional thin-film nanostructures such as nanowires and periodic grids of the nanowires on the substrate surface.
5 cl, 2 dwg
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