FIELD: chemistry.
SUBSTANCE: invention refers to the technology of multilayer semiconductor structures of compounds A3B5 by the method of liquid-phase epitaxy, and more particularly to methods of manufacturing semiconductor p-i-n structures in the system GaAs-GaAlAs for power electronic equipment. When the structure is grown to the temperature range of inversion of the silicon impurity in gallium arsenide of 885-895°C, the epitaxial process is carried out in an atmosphere of high-purity inert gas, and then to the temperature of the epitaxy termination - in an atmosphere of high-purity hydrogen.
EFFECT: increase in the values of the reverse breakdown voltage simultaneously with the elimination of thyristor regions on the current-voltage characteristics of the structures obtained.
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Authors
Dates
2018-10-02—Published
2016-10-27—Filed