FIELD: power microelectronic engineering.
SUBSTANCE: invention relates to the field of power microelectronic engineering, and more specifically to methods for manufacturing semiconductor p-i-n structures from A3B5 compounds by epitaxy methods. The method includes composing an initial charge, loading gallium, charge components and GaAs substrates into a graphite growth device, and then into a reactor; heating the contents of the reactor in a dehydrated atmosphere, followed by annealing in the same atmosphere; contacting the substrate with the resulting melt solution; subsequent forced cooling for growing a GaAs epitaxial layer having a p-i-n structure; removal of the substrate covered with a GaAs layer having a p-i-n structure from under the melt. At least gallium oxide Ga2O3 and monocrystalline silicon Si are added to the charge.
EFFECT: invention makes it possible to obtain p-i-n structures of gallium arsenide by the LPE method with high reproducibility of the basic electrophysical parameters of the structures and with a high yield of suitable structures.
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Authors
Dates
2021-06-11—Published
2020-10-06—Filed