FIELD: technological processes; electrical engineering.
SUBSTANCE: use for the manufacture of electronic devices. Essence of the invention is that a method comprising forming on a common support one or more series of multi-layer electronic devices, and then separating the electronic devices; wherein the devices comprise one or more organic layers, the method comprising depositing one or more of the organic layers as a respective continuous layer extending at least from one end of the one or more series of devices to an opposite end of the one or more series of devices, said devices comprising at least three conductor layers arranged at respective levels, the method further comprises creating one or more conductive connections between one or more parts of an upper conductor layer in a peripheral region and one or more parts of an intermediate conductor layer inwards of said peripheral region, via one or more parts of a lower conductor layer extending between said peripheral region and said region inwards of said peripheral region.
EFFECT: ensuring the possibility of reducing defects frequency in devices including organic materials.
11 cl, 4 dwg
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Authors
Dates
2018-11-19—Published
2014-10-07—Filed