FIELD: photodetectors.
SUBSTANCE: invention relates to a technology for manufacturing thin hybridized assemblies (THAs) with minimal damage to the surface and edges and can be used to create matrix photodetectors (MPDs) for various purposes. To produce THAs, grooves of a certain depth are etched on the front side of the matrix photosensitive elements matrix (MPSE) plate, after which plate M×K of MPSE is hybridized with individual readout LSICs and the base region of the MPSE is thinned to the level of grooves. In this case, separation of the MPSE plate into individual MPSE crystals and, accordingly, into individual THAs (in the amount of M×K) occurs through thinning to the level of the grooves.
EFFECT: invention solves the problem of group production of thinned hybridized assemblies with increased yield of suitable products due to hybridization of individual large-scale integrated readout circuits with a plate of matrix photosensitive elements.
1 cl, 4 dwg
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Authors
Dates
2024-01-11—Published
2023-06-16—Filed